DIP Package

DIP Package

Overview of Characteristic

  • Support Wi-Fi IEEE802.11b/g/n and BLE4.2 Wireless Standards
  • Based on ARM9E SOC, 120MHz CPU, 256KB RAM, 2MB Flash
  • Support UART Data Communication with Wi-Fi or BLE 
  • Support Wi-Fi STA/AP/AP+STA Mode
  • Support Wi-Fi Sniffer SmartLink V8, WeChat Airkiss 2.0 Config
  • Support Wi-Fi AP SmartAPLink Config
  • Support BLE SmartBLELink Config
  • Support Wireless and Remote Firmware Upgrade Function
  • Support Software SDK for Develop
  • Support Internal PCB or External IPEX Antenna Option
  • Single +3.3V Power Supply
  • Size: 23.1mm x 32.8mm x 3.5mm,SMT34 package

Sizing Table

Name HF-LPC330  >>
Image HF-LPC330
Wireless Standard 802.11b/g/n BLE 4.2
Key Feature Support Software SDK for Develop
Processor ARM9E SOC
Basic Frequency 120MHz
Operating System alios
Temp. Range -40~+85
Internal Antenna
I-PEX Connector
Size (mm) 22mm x 15.6mm x 8mm
Package Type DIP10
Work Voltage 3.0~3.6V
Current @No data 25mA
Current @Tx Peak 260mA
Resource-Flash 2MB
Resource-RAM 256KB
Interface-UART 2
Interface-PWM PWM0~PWM5
Interface-SPI 1
Interface-GPIO
AP Mode
STA Mode
AP+STA Mode
WPS Function
Web Server
OTA Upgrade
Airkiss Configure
SDK Support
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